Novaclad® HDI (adhesiveless)

Novaclad® HDI (high-density interconnect) is designed to withstand the toughest temperatures, chemical exposures, and vibrations.

Designed for the toughest applications.

Built on our proprietary adhesiveless laminate, Novaclad® HDI leverages our vacuum deposition, mSAP (modified semi-additive process), and photolithography to enable fine-line circuitry. And through the ability to control copper thickness, Novaclad® HDI also enables greater design flexibility.

Take innovation in a whole new direction with the flexibility to overcome your biggest design challenges. 


  • Fine-grain structured copper
  • NovaPET (polyethylene terephthalate) films
  • PI (polyimide) films

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