Novaclad® HDI (adhesiveless)
Novaclad® HDI (high-density interconnect) is designed to withstand the toughest temperatures, chemical exposures, and vibrations.
Designed for the toughest applications.
Built on our proprietary adhesiveless laminate, Novaclad® HDI leverages our vacuum deposition, mSAP (modified semi-additive process), and photolithography to enable fine-line circuitry. And through the ability to control copper thickness, Novaclad® HDI also enables greater design flexibility.
Materials
- Fine-grain structured copper
- NovaPET (polyethylene terephthalate) films
- PI (polyimide) films
Materials
- Fine-grain structured copper
- NovaPET (polyethylene terephthalate) films
- PI (Polyimide) films
Adhesive-based circuits
Our single- and double-sided adhesive-based circuits help enable new possibilities in flexible technology.
Q-Prime® thermal management
The only thermal management circuit processed in roll-to-roll format that is thin and flexible enough to fold and hold a bend.
Human-machine interface (HMI)
Enabling more intuitive, human-centered connectivity across the consumer goods universe.
Transparent circuits
Our transparent circuits provide the performance and flexibility to conform to the most complex surfaces.
We’re here to help.
Connect with our engineers to find the right solution for any challenge.