Adhesive-based copper laminates
For over 60 years, our adhesive-based copper laminates have been enabling new possibilities in flexible circuitry.
Bringing your flexible circuit designs together.
Our adhesive-based copper laminates enable high-performing copper circuitry for a range of electronic applications. With excellent adhesion and high thermal performance, these laminates help ensure a strong and reliable bond. It’s a bond that can withstand the high internal temperatures that electronic devices can generate.
In addition to their strength and durability, our adhesive-based copper laminates are also more cost-effective than other methods used in creating copper circuitry. This makes them ideal for high-volume manufacturing.
Substrates 1, 2, 3 & 5 mils
Non flame retardant
Electro-deposited high ductility (EDHD) .5, 1 & 2 oz.
Rolled-annealed (RA) 1 & 2 oz.
- Substrates 1, 2, 3 & 5 Units
- Flame retardant
- Non flame retardant
- Electro-Deposited High Ductility (EDHD) .5, 1, & 2 oz.
- Rolled-Annealed (RA) 1 & 2 oz.
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