Adhesive-based copper laminates

For over 60 years, our adhesive-based copper laminates have been enabling new possibilities in flexible circuitry.

Bringing your flexible circuit designs together.

Our adhesive-based copper laminates enable high-performing copper circuitry for a range of electronic applications. With excellent adhesion and high thermal performance, these laminates help ensure a strong and reliable bond. It’s a bond that can withstand the high internal temperatures that electronic devices can generate.  

Whether you are looking to improve copper peel strength or reduce overall material costs, we’re here to help make it happen.

In addition to their strength and durability, our adhesive-based copper laminates are also more cost-effective than other methods used in creating copper circuitry. This makes them ideal for high-volume manufacturing.


Substrates 1, 2, 3 & 5 mils





Flame retardant

Non flame retardant


Electro-deposited high ductility (EDHD) .5, 1 & 2 oz.

Rolled-annealed (RA) 1 & 2 oz.

We’re here to help.

Connect with our engineers to find the right solution for any challenge.