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We offer unparalleled aerospace technologies and continue to develop new solutions to take on the challenges of tomorrow. See how our solutions help make the seemingly impossible possible.
Our flexible printed circuits are built upon our proprietary adhesiveless laminate that leverages vacuum deposition, mSAP, and photolithography to enable fine-line circuitry.
We create the only thermal management circuit processed in roll-to-roll format that is thin and flexible enough to fold and hold a bend.
We offer over 20 tape splicing systems that are designed to meet specific industry requirements and are color-coded to provide easy identification for belt manufacturers.